CLOSING EVENT Flexlines

CLOSING EVENT Flexlines

Flexlines will be organising a last webinar on December 10. At this Closing Event the Flexlines team will be glad to give you an overview of the highlights of the project. Every project partner will present the milestones that have been reached the passed 3 years.

The Flexlines consortium has developed a pilot line and 'one-stop-shop' for the realisation of flexible electronics prototypes. Our team will also put a light on the improvement of TFT performance, on thermoforming and injection moulding, on design issues,…

Flexlines is a consortium of research and academic partners and a cluster organization. We want to develop and coordinate the individual links in the Flexible Electronics value chain: processes and infrastructure for design and production. The aim of this project is to build a state-of-the-art but stable pilot line and then set up a one-stop-shop for the realisation of Flexible Electronics prototypes

Flexlines unites different players providing access to new Flexible Electronics technologies through one-stop-shop concepts in order to accelerate the design, development, and uptake of advanced applications in Flexible & Wearable Electronics.

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PROGRAM

- INTRODUCTION  
Dieter Therssen, CEO, DSP Valley

- A WORD FROM THE DIRECTOR OF INTERREG
Bram De Kort, Director Interreg Vlaanderen-Nederland

- A WORD FROM THE DEPUTY OF PROVINCE FLEMISH BRABANT
Marlies Vanthyune for Ann Schevenels, Deputy Province of Flemish Brabant

- FLEXLINES ONE-STOP-SHOP:
Romano Hoofman, Program Director, imec

- LARGE-AREA SHEET-2-SHEET THIN FILM TRANSISTOR PILOT LINE INFRASTRUCTURE 
Auke Jisk Kronemeijer, Senior Researcher & GEN1 TFT Pilot Line Manager, TNO/Holst Centre

- UNDERSTANDING AND IMPROVING TFT PERFORMANCE:
Rene Janssen, Professor Molecular Materials and Nanosystems, TU/E

- CIRCUIT DESIGN TECHNIQUES WITH InGaZnO THIN-FILM TRANSISTORS FOR LARGE AREA ELECTRONICS:
Mohit Dandekar, research assistant, KU Leuven

- PRINTED ELECTRONICS FOR THERMOFORMING AND INJECTION MOULDING:
Margreet De Kok, Program manager structural electronics, TNO/Holst Centre

- THE EFFECT OF OVERMOULDING ON RELIABILITY OF FLEXIBLE ELECTRONIC CIRCUITS:
Mona Bakr, Researcher, imec CMST

- INJECTION OVER-MOULDING FLEXIBLE ELECTRONICS WITH ENGINEERING THERMOPLASTICS:
Yibo Su, Scientist, Brightlands Materials Center

- CONCLUSIONS / CLOSING REMARKS - ONE-STOP-SHOP REMINDER
Romano Hoofman, Program Director, imec

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Flexlines brings together leading partners: 

Practical info:

    When: December 10, 2020
    Location: Online
    Organiser: Flexlines partners
    Price: FREE
    Extra info:

    10:30h-12:30h

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